WILMINGTON, DE — Qnity Electronics Inc. (NYSE: Q) has expanded its thermal management portfolio with two new thermal interface materials aimed at addressing rising heat dissipation demands in artificial intelligence, automotive and other high-power semiconductor applications.
The company introduced the Laird Tflex CR910 liquid gap filler and Laird Tgrease 3000 thermal grease, positioning the products to address increasing power densities and more complex electronic designs that require improved thermal performance and long-term reliability.
Thermal management has become a critical engineering challenge as AI computing, electrification and advanced semiconductor architectures generate higher operating temperatures while reducing design tolerances.
Qnity indicated the products are intended to help engineers improve heat transfer while maintaining performance across increasingly demanding operating environments.
Chuck Xu, president of Interconnect Solutions at Qnity, described thermal management as a key factor in advancing next-generation electronics.
“As AI, advanced computing and electrification continue to push system performance to new levels, managing heat has become one of the industry’s most important engineering challenges,” Xu said. “Thermal management is no longer simply about protecting components—it’s about enabling the next generation of innovation.”
The Laird Tflex CR910 is a two-part, dispensable liquid gap filler with thermal conductivity of 9.2 watts per meter-kelvin. The material is designed to accommodate large or uneven gaps while maintaining thermal performance and resisting mechanical stress.
The Laird Tgrease 3000 is a non-silicone thermal grease certified for operating temperatures up to 200 degrees Celsius. Engineered for silicon carbide and gallium nitride semiconductor devices, it provides thermal conductivity of 3.2 watts per meter-kelvin and is designed to reduce thermal resistance and pump-out, helping improve reliability and extend component life in high-temperature applications.
Qnity stated the product launches build on its materials science and application engineering capabilities as demand grows for thermal management technologies across the semiconductor value chain.
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