WILMINGTON, DE — Qnity Electronics Inc. (NYSE: Q) is expanding its semiconductor materials portfolio with a new family of chemical mechanical planarization slurries aimed at advanced packaging processes used to increase chip density and bandwidth for artificial intelligence and high-performance computing.
The Stackplane product family targets chemical mechanical planarization, or CMP, steps used in hybrid bonding, through-silicon vias and other advanced packaging architectures. Those processes are becoming more important as semiconductor manufacturers combine continued transistor scaling with the stacking and integration of multiple chips.
Qnity said the portfolio combines existing commercial products with newer slurry technologies under a single platform for wafer- and die-level planarization.
The company divided the lineup into four series: SP1000 and SP2000 for hybrid bonding, SP3000 for through-silicon via applications, SP4000 for polymer CMP and SP5000 for emerging processes including panel-level through-glass vias and glass CMP.
The broader push is designed to address advanced packaging programs that require multiple CMP steps with different material selectivity and surface-planarization requirements.
“Advanced packaging is creating new demands for precision, performance, and reliability across semiconductor manufacturing,” Kate Dei Cas, president of Qnity’s Semiconductor Technologies business, said.
She said the Stackplane platform extends Qnity’s existing advanced packaging materials portfolio as customers develop more complex integration schemes.
Qnity said the slurries are engineered to provide consistent planarization while meeting the material-selectivity requirements of different packaging processes.
The company will showcase the Stackplane family at SEMICON Taiwan from Sept. 2-4 in Taipei, including a Sept. 2 presentation by Allison Hsu, its Taiwan slurry research and development manager.
Qnity also plans to feature the platform at the International Conference on Planarization/CMP Technology from Oct. 19-22 in Seoul.
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