MALVERN, PA — Vishay Intertechnology, Inc. (NYSE: VSH) introduced a thin film submount platform designed for optical transceivers, RF modules and advanced electronic packaging applications requiring high thermal performance and signal integrity.
The platform targets high-speed data communications applications, including 800G, 1.6T and 3.2T optical transceivers, where increasing power density and tighter packaging constraints require improved heat dissipation and alignment precision.
The company said the platform uses thin film deposition of passive circuit elements and ceramic substrates, including aluminum nitride, to support thermal conductivity, dimensional stability and electrical performance.
Vishay said the submounts are designed to maintain signal integrity at high frequencies while enabling thermal management at the device level.
The platform supports applications such as laser diode mounting, RF and microwave modules, optical alignment and hermetic packaging, and is used in defense, space and industrial systems.
Michael Casper, vice president of specialty thin film, said the platform is intended to address performance limits in photonics and RF systems, including thermal, mechanical and electrical constraints.
The platform includes manufacturing capabilities across three locations, supporting both prototyping and volume production, and is designed to reduce manufacturing complexity through pre-deposited materials and precision machining.
The company develops electronic components and systems used in power management, signal processing and electronic packaging.
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