WILMINGTON, DE — Qnity Electronics, Inc. (NYSE: Q) is expanding its semiconductor materials portfolio with a family of chemical mechanical planarization slurries designed for advanced chip packaging, targeting manufacturing processes increasingly used to deliver the bandwidth and density required by artificial intelligence and high-performance computing.
The Wilmington-based company introduced the Stackplane™ product family for chemical mechanical planarization, or CMP, including applications involving hybrid bonding, through-silicon vias, polymers and emerging glass-based packaging technologies.
Advanced packaging has become increasingly important as semiconductor manufacturers combine continued transistor scaling with the vertical stacking and integration of multiple chips. Those architectures can require multiple CMP steps to create sufficiently flat surfaces during manufacturing.
Qnity’s new portfolio combines existing commercial products with newer slurry technologies intended for planarization at both the wafer and individual die level.
“Advanced packaging is creating new demands for precision, performance, and reliability across semiconductor manufacturing,” Kate Dei Cas, president of Qnity’s Semiconductor Technologies business, said.
The Stackplane SP1000 and SP2000 series target hybrid-bonding processes, while the SP3000 series is designed for through-silicon via applications.
The SP4000 series addresses polymer CMP. The SP5000 line targets emerging processes including panel-level through-glass vias and glass CMP.
The expansion positions Qnity to supply materials across more stages of advanced packaging as semiconductor manufacturers develop increasingly complex chip architectures rather than relying exclusively on conventional transistor scaling.
Qnity featured the Stackplane products at SEMICON Taiwan, which ran Sept. 2 through Sept. 4 in Taipei. The company plans to present the platform again at the International Conference on Planarization/CMP Technology in Seoul from Oct. 19 through Oct. 22.
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