WILMINGTON, DE — Qnity Electronics, Inc. (NYSE: Q) raised its full-year financial outlook after reporting first-quarter revenue growth driven by demand for artificial intelligence infrastructure, advanced semiconductor packaging, and high-performance computing systems.
The company reported first-quarter net sales of $1.3 billion for the period ended March 31, up 18% from a year earlier, with organic sales growth of 17%.
Adjusted earnings rose 33% year over year to $226 million, while adjusted operating EBITDA increased 22% to $411 million. Adjusted earnings per share rose to $1.08 from the prior-year quarter.
GAAP results weakened despite higher sales. Net income declined 19% to $162 million, while GAAP earnings per share fell 22% to $0.72.
Chief Executive Officer Jon Kemp attributed growth to rising demand for increasingly complex AI computing systems requiring advanced chips, packaging technologies, interconnect products, and thermal management systems.
“Growth today is increasingly coming from stacking chips and building more complex, integrated systems,” Kemp said. “Qnity is uniquely positioned as a partner of choice—helping customers build, scale, and operate next generation computing platforms.”
The company said it expanded collaborations with technology customers during the quarter and increased investment aimed at expanding manufacturing capacity and strengthening localized supply-chain operations.
Qnity raised guidance across all major financial metrics for 2026, forecasting full-year net sales between $5.225 billion and $5.375 billion.
The company expects adjusted operating EBITDA of $1.535 billion to $1.625 billion and adjusted earnings per share of $3.80 to $4.14.
Qnity also projected adjusted free cash flow between $500 million and $600 million for the year.
The results reflect continued investor and industry focus on infrastructure suppliers benefiting from rapid expansion in AI data center construction and next-generation computing platforms, where semiconductor performance increasingly depends on advanced packaging and thermal-management technologies rather than chips alone.
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