WILMINGTON, DE — Qnity Electronics (NYSE: Q) has received ASE Technology Holding’s 2025 Best Supplier Award, a recognition that highlights the company’s position in the semiconductor packaging supply chain as demand for AI and high-performance computing chips continues to drive investment in advanced packaging technologies.
The award was presented by Taiwan-based ASE, one of the world’s largest outsourced semiconductor assembly and test providers, and recognizes supplier performance across materials, equipment and services.
The recognition centers on Qnity’s silicone-based materials used in semiconductor packaging, including lid seal and thermal interface materials that support advanced chip assembly processes.
The award comes as semiconductor manufacturers increasingly rely on advanced packaging techniques to improve chip performance, power efficiency and thermal management for artificial intelligence, data center and other high-computing applications.
Qnity said its materials are used in ASE’s flip chip-ball grid array, or FCBGA, packaging operations and other advanced packaging applications. The companies have worked together on production support, product qualification and manufacturing scale-up efforts.
“The move to 3D architectures and advanced packaging is raising the bar for performance, reliability, and manufacturability across the industry,” Chuck Xu, president of Interconnect Solutions at Qnity, said in a statement. “ASE’s recognition highlights the role our materials play in enabling next-generation semiconductor packaging.”
Advanced packaging has become an increasingly important segment of the semiconductor industry as chipmakers seek alternatives to traditional transistor scaling and develop more complex designs for AI workloads.
Qnity provides materials used throughout the semiconductor packaging process, including products for circuit metallization, chemical mechanical planarization, thermal management and chip sealing applications.
The company said its silicone-based materials are designed to withstand the operating conditions associated with advanced semiconductor devices used in AI and data center infrastructure.
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