WILMINGTON, DE — Qnity Electronics (NYSE: Q) is expanding its investment in advanced semiconductor packaging by joining imec’s research program, giving the company access to research infrastructure and industry partnerships as chipmakers move toward increasingly complex three-dimensional architectures.
The collaboration gives Qnity access to imec’s semiconductor research programs, infrastructure, technical experts and network of industry and academic partners.
Qnity is positioning its materials portfolio around a shift toward chiplets, high-bandwidth memory, wafer-level packaging, 3D stacking and heterogeneous integration as artificial intelligence and high-performance computing increase demands for processing performance and efficiency.
Those technologies increasingly rely on advanced packaging to combine components vertically rather than depending solely on conventional two-dimensional chip designs.
Qnity’s portfolio spans materials and technologies used across semiconductor manufacturing and packaging, including patterning, planarization, metallization, interconnects and thermal management.
The imec relationship is intended to support longer-term research and co-development of materials as those packaging architectures evolve.
“As computing moves toward shrink and stack, advanced packaging is becoming one of the most critical frontiers for performance, efficiency and scale,” Qnity Chief Technology Officer Randy King said.
King indicated participation in imec’s research ecosystem would give Qnity greater access to infrastructure, technical expertise and industry partners as it develops materials for future semiconductor technologies.
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