LANCASTER, PA — Advanced Cooling Technologies, Inc. (ACT) has been awarded $1.1 million in funding through the U.S. Department of Energy’s ARPA-E program. This funding, part of the COOLERCHIPS initiative, is aimed at advancing energy-efficient cooling solutions for data centers, a critical component as the demand for data processing continues to rise.
ACT’s involvement spans two innovative projects. The first, in partnership with Intel and Purdue University, focuses on developing two-phase immersion cooling for high-power server devices, targeting power levels up to 2 kW. This project will see ACT working on novel heat sinks through Topology Optimization, with the aim of achieving a thermal resistance from chip to coolant of less than 0.01 kW for servers ranging from 10-100 kW in total power. The successful implementation of this technology promises to enhance server power density and reliability while significantly cutting power consumption and carbon emissions.
The second project involves collaboration with the University of Missouri to create a Dual-Mode Hybrid Two-Phase Loop for Data Center Cooling. This technology is designed to provide a scalable cooling solution that surpasses current phase-change methods. ACT will contribute to the development and testing of hardware capable of managing system loads up to 10 kW.
Dr. William Anderson, Chief Engineer at ACT, expressed the importance of these projects, stating, “We are excited to be part of two teams that are selected to receive funding from ARPA-E under the COOLERCHIPS program. It is a testament of ACT’s capabilities and engineering experience in developing next generation cooling technologies.”
As part of these ventures, ACT will leverage its expertise to develop and test prototypes, ultimately paving the way for more sustainable and high-performance data center operations. The projects are set to unfold over the next three years, with the potential to revolutionize how data centers manage thermal challenges in high-power environments.
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