LANCASTER, PA — Advanced Cooling Technologies, Inc. (ACT) has announced a significant step forward in thermal management with the successful demonstration of its latest two-phase direct-to-chip liquid cooling technology. The new cold plate is engineered to handle the extreme heat loads generated by next-generation high-performance computing (HPC) and artificial intelligence (AI) hardware.
In recent tests, the cold plate dissipated more than 7.5 kW on a single unit, replicating the thermal demands of emerging “superchip” architectures. The technology also demonstrated heat flux capacity exceeding 300 W/cm² across multiple zones simultaneously, ultra-low thermal resistance of 0.060 °C-cm²/W, and reliable operation at flow rates below 0.8 LPM/kW. Surface temperatures were held below 70 °C even with coolant entering at 50 °C, ensuring stability under high-stress conditions.
“These results represent a major milestone in the advancement of two-phase direct-to-chip cooling solutions for next-generation data centers and AI-driven computing systems,” said Devin Pellicone, Head of Data Center Solutions at ACT. “Our latest cold plate technology is enabling the industry to support the rack power densities of the future with unprecedented efficiency and reliability.”
As data centers and AI workloads continue to drive higher power densities, effective thermal management is increasingly vital to performance and energy efficiency. ACT’s innovation positions the company at the forefront of cooling solutions designed to scale with the rapid evolution of computing power.
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