New Vishay Intertechnology ThermaWick™ SMD Thermal Jumper Chip Removes Heat From Electrically Isolated Components

New Vishay Intertechnology ThermaWick™ SMD Thermal Jumper Chip Removes Heat From Electrically Isolated ComponentsThe Vishay Dale Thin Film ThermaWick™ THJP series surface-mount thermal jumper chip removes heat from electrically isolated components, enabling higher power handling capability or longer useful life. (Photo courtesy of Vishay Intertechnology)
Device Reduces Component Temperature by Over 25%, Enabling Higher Power Handling Capability or Longer Useful Life

MALVERN, PA — Vishay Intertechnology, Inc. (NYSE: VSH) this week introduced the ThermaWick™ THJP series surface-mount thermal jumper chip. The Vishay Dale Thin Film device allows designers to transfer heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.

Featuring an aluminum nitride substrate with high 170 W/m°K thermal conductivity, the chip released today is capable of reducing the temperature of connected components by over 25%.

This reduction allows designers to increase the power handling capability of these devices or extend their useful life at existing operating conditions while maintaining the electrical isolation of each component.

By protecting adjacent devices from thermal loads, overall circuit reliability is improved.

The THJP’s low capacitance down to 0.07 pF makes it an excellent choice for high frequency and thermal ladder applications.

READ:  Genesis HealthCare to Release First Quarter 2020 Results and Provide COVID-19 Update on May 27, 2020

The thermal conductor will be used in power supplies and converters; RF amplifiers; synthesizers; pin and laser diodes; and filters for AMS, industrial, and telecommunications applications.

The device is available in six case sizes from 0603 to 2512, with custom sizes available. The 0612 and 1225 cases feature long side terminations for additional heat transferring capability. The thermal jumper is available with lead (Pb)-bearing and lead (Pb)-free wraparound terminations.

Device Specification Table:

Case size Thermal resistance (°C/W) Thermal conductance (mW/°C) Capacitance (pF)
0603 14 70 0.07
0612 4 259 0.26
0805 13 77 0.15
1206 15 65 0.07
1225 4 259 0.26
2512 15 65 0.07
Samples and production quantities of the ThermaWick THJP series thermal jumper are available now from the Comapny, with lead times of six weeks.

READ:  Teleflex Incorporated Announces Private Offering of $500 Million of Senior Notes Due 2028

Thanks for visiting! MyChesCo brings reliable information and resources to Chester County, Pennsylvania. Please consider supporting us in our efforts. Your generous donation will help us continue this work and keep it free of charge. Show your support today by clicking here and becoming a patron.

Buy Us a Cup of Coffee