MALVERN, PA — Vishay Intertechnology, Inc. (NYSE: VSH) this week introduced two new n-channel TrenchFET® MOSFETs that increase power density, efficiency, and board-level reliability in telecom and industrial applications. To achieve these design goals, the 60 V SiJH600E and 80 V SiJH800E combine ultra-low on-resistance with a high-temperature operation to +175 °C and high continuous drain current handling. Their space-saving PowerPAK® 8x8L package promotes board-level reliability with its bond wireless construction and gullwing leads for mechanical stress relief.
The ultra-low on-resistance of the SiJH600E and SiJH800E — 0.65 mΩ and 1.22 mΩ typical at 10 V, respectively — is 54 % and 52 % lower than same-generation devices in the PowerPAK SO-8. This translates into energy savings by minimizing power losses due to conduction.
For increased power density, the SiJH600E and SiJH800E deliver continuous drain current of 373 A and 288 A, respectively, in a package that is 60 % smaller and 57 % thinner than the D²PAK. To save board space, each MOSFET can also be used in place of two PowerPAK SO-8 devices in parallel.
Device Specification Table:
|Part Number||VDS (V)||ID (A)||RDS(ON) @ 10 V (mΩ)||Rthjc (°C/W)|
Package Comparison Table:
|Package||Length (mm)||Width (mm)||Thickness (mm)||Dimension (LxW mm²)|
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